The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 1992
Filed:
Apr. 02, 1990
Fuji Xerox Co., Ltd., Tokyo, JP;
Abstract
The present invention is directed toward a printed-circuit substrate comprisng a first layer having through holes formed through a sheet impregnated with resin which shows a half-hardened property at the time of impregnation, a first electrically conductive circuit provided on the sheet, and a second layer having an electrically conductive circuit provided on either a metal or resin substrate. The first and second layers are pressure-stuck to each other and the through holes are filled with an electrically conductive material. The present invention is also directed to a method of making a printed-circuit substrate comprising the steps of: forming through holes and a first electrically conductive circuit respectively throgh and on at least one layer of a sheet impregnated with resin which shows a half-hardened property at the time of impregnation, thereby forming a first layer; forming a second electrically conductive circuit on an insulating plate having through holes formed therein and plating said through holes and opposite surfaces of the insulating plate, thereby forming a second layer; heat sticking said first layer onto said second layer; and filling said through holes with an electrically conductive material, thereby electrically connecting the first and second electrically conductive circuits.