The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 1992
Filed:
Mar. 05, 1990
Applicant:
Inventors:
Yuji Ohashi, Tokyo, JP;
Nobuto Yamazaki, Tokyo, JP;
Assignee:
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ; H01L / ;
U.S. Cl.
CPC ...
228102 ; 228-11 ; 228179 ;
Abstract
A wire bonding method wherein a bonding tool is lowered in a pre-loaded state, and bonding is performed under a bonding load which is smaller than the pre-loading load. The pre-loading load is changed to the bonding load before the bonding tool contacts a bonding point, and the bonding tool contacts the bonding point under such bonding load, thus performing bonding. Such bonding is performed also by changing the pre-loading load into a load which is smaller than the bonding load before the bonding tool contracts a bonding point and further changing such load into the bonding load after the bonding tool has contacted the bonding point.