The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 1991
Filed:
Apr. 29, 1991
James J Ganthier, Spring, TX (US);
Compaq Computer Corporation, Houston, TX (US);
Abstract
The projecting underside connector portions on an electrical component are removably connected to surface mounted electrical contact points on one side of a printed circuit board using a specially designed interconnect device. The interconnect device includes a support board through which a spaced series of openings transversely extend, the openings being alignable with the component connector portions and the surface mounted contact points. Barrel portions of longitudinally resilient, electrically conductive connector pin members are anchored within the support board openings and have recessed first end portions positioned adjacent a first side of the support board and configured to removably receive and firmly hold the electrical component connector portions. Projecting outwardly beyond the second side of the support board are spring-loaded, longitudinally depressible second end portions of the connector pin members. To use the interconnect device, the electrical component connector portions are plugged into the open pin member barrel ends and peripheral portions of the support board are removably secured to the printed circuit board in a manner holding the second pin member end portions in longitudinally depressed engagement with the surface mounted electrical contact points. Compared to conventional 'through-hole' component mounting methods, this interconnect method leaves the interior and opposite side surface portions of the circuit board beneath the mounted component free for additional circuitry for other components if desired.