The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 1991
Filed:
Jul. 24, 1990
Koichi Hashiguchi, Chiba, JP;
Koji Yamato, Chiba, JP;
Junji Kawabe, Chiba, JP;
Ichiro Tanokuchi, Okayama, JP;
Kawasaki Steel Corporation, Kobe, JP;
Abstract
A continuous dip-plating apparatus for a steel strip has a pot containing a metal melt which forms a plating bath, a device for causing the steel strip to run through the plating bath such that the steel strip makes a turn around a sink roll in the plating bath so as to be pulled upwardly above the surface of the plating bath, and a wiping device disposed above the pot and adapted for adjusting the amount of deposition of the metal melt to the steel strip. The apparatus further has a pair of flow regulating plates for suppressing deposition of dross to the steel strip. The flow regulating plates are arranged in parallel with and in the vicinity of the portion of the steel strip running upwardly through the plating bath with the upper ends of the flow regulating plates being disposed substantially at the same level as the plating bath. Preferably, the height of the portion of each flow regulating plate below the level of the surface of the plating bath is not smaller than 50 mm, while the distance between each flow regulating plate and the steel strip is preferably not greater than 80 mm. It is also preferred that the upper end of each flow regulating plate is positioned between a level which is 10 mm below the surface of the plating bath and a level which is 50 mm above the surface of the plating bath.