The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 1991
Filed:
Jul. 13, 1990
Murray J Robinson, Mountain View, CA (US);
Ywan-Lung Tsay, San Jose, CA (US);
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
A slotted metallic die attach pad is disclosed for attachment of a semiconductor die, such as a silicon die, to form a die assembly demonstrating significantly reduced die attach stress. A plurality of substantially parallel, unidirectional slots in the die attach pad permits deformation of the die attach pad at the slots to compensate for differences in the thermal expansion coefficients of the silicon die and the metallic die attach pad. Stress sensitive components of the die are aligned in a stress sensitive direction, and the die is bonded on the die attach pad so that the stress sensitive direction is generally orthongonal to the longitudinal axes of the slots. A method for relieving die stress in a die assembly is also disclosed.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile