The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 1991

Filed:

Aug. 30, 1990
Applicant:
Inventor:

James V Crivello, Clifton Park, NY (US);

Assignee:

Polyset Corporation, Round Lake, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C07F / ; C07F / ; C07F / ; C07F / ;
U.S. Cl.
CPC ...
556 64 ; 427 541 ; 522 15 ; 522 25 ; 568-6 ; 568 16 ; 568 17 ; 568 28 ; 570123 ; 570130 ;
Abstract

Synthesis use of a new class of diaryliodonium salt photo and thermal polymerization initiators in which the aryl groups are substituted with alkoxy group bearing hydroxy groups. Good to excellent yields are obtained of diaryliodonium salts in which the aryl groups are substituted with long chain alkoxy groups, which alkoxy groups also possess at least one hydroxyl moiety attached at the 2-position of an alkoxy group. The resultant salts have enhanced solubility when compared with their lower molecular weight counterparts. The hydroxyl groups serve as chain transfer agents; and, in cross linking UV-induced cationic polymerizations, the hydroxyl groups effect marked accelertion on polymerization rates. The salts also have excellent compatability with nonpolar monomers such as epoxidized oil and poly(1,2-butadience oxide) and provide further benefits when they are used along with copper cocatalysts in thermally curable polymer systems. In the latter form of cases, the secondary hydroxyl group serves as a reducing agent for the copper (II) complex.


Find Patent Forward Citations

Loading…