The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 1991
Filed:
Mar. 20, 1991
Kernforschungszentrum Karlsruhe GmbH, Karlsruhe, DE;
Abstract
In a method of making molds with microstructured recesses having a continuous base covered by a film of an electrically conductive material for forming in the recesses, by electrodeposition, microstructured plate-like bodies a microstructure master mold is pressed into a layer of thermoplastic material coated with a film of an electrically conductive material at a temperature which is above the softening temperature of the thermoplastic material such that the thermoplastic material with the electrically conductive film thereon first contacts the microstructure face and then enters the recesses in the microstructure. The master mold and thermoplastic material are then cooled and the master mold is removed whereby the thermoplastic material provides a negative mold of the microstructure having a continuous electrically conductive film disposed on the recess bases whereas the remainder of the electrically conductive film is broken apart and disposed in isolated spangles on the rest of the microstructured mold. The microstructured negative mold is then ready for electrodeposition of a metal in the microstructure recesses using the electrically conductive film therein as an electrode.