The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 1991

Filed:

Dec. 10, 1990
Applicant:
Inventor:

Masayuki Kokado, Machida, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 41 ; 357 43 ; 357 40 ; 357 59 ; 357 49 ;
Abstract

A semiconductor integrated circuit is supplied with a power source voltage to a circuit element forming layer thereof from a conductive layer through a substrate and a certain region made of a semiconductor type identical to that of the substrate. The conductive layer is formed on a back surface of the substrate, and the certain region makes contact with a front surface of the substrate. The circuit element forming layer is provided on the front surface side of the substrate and connects to the certain region. Alternatively, a region may be provided to extend from the circuit element forming layer to the substrate so as to provide a conductive path for supplying the power source voltage from the back surface of the substrate.


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