The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 1991
Filed:
Dec. 18, 1990
Mitsuyuki Banba, Kanagawa, JP;
Hideki Matsuo, Kanagawa, JP;
Yasuo Nakayama, Chiba, JP;
Hideo Suzuki, Chiba, JP;
Sony Corporation, Tokyo, JP;
Abstract
The present invention relates to a method for soldering two kinds of parts, parts with leads and chip parts, on one-side printed board, comprising coating a cream solder on a plurality of points of a wiring pattern surface of one-side printed board and coating an adhesive for adhering parts with leads on a non-wiring pattern, adhering parts with leads to said non-wiring pattern surface by said adhesive, passing leads of the parts with leads through lead insert holes of said one-side printed board to insert the same into one cream solder on the wiring pattern surface from the side of the non-wiring pattern surface, mounting chip parts on the other cream solder on said wiring pattern surface, thereafter heating at once the whole cream solder on the wiring pattern to simultaneously reflow-solder the parts with leads and chip parts whereby the parts with leads and the chip parts can be simultaneously soldered by a single reflow soldering step.