The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 1991

Filed:

Feb. 14, 1990
Applicant:
Inventor:

William H Miller, Wadsworth, OH (US);

Assignee:

GenCorp Inc., Fairlawn, OH (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C / ; B29C / ;
U.S. Cl.
CPC ...
2641761 ; 2641771 ; 2642092 ; 2642098 ; 264285 ; 264339 ;
Abstract

A method is described for bending an extrudate exiting an opening in an die assembly without substantially changing the cross sectional shape of the extrudate. The method includes the step of channeling the flow of extrudate from an extruder through a flow channel and the opening in the die. The opening in the die is rotated with respect to the feed opening to vary the length of the flow channel and pathways along which extrudate flows thereby variably directing flow of the extrudate as the extrudate exits the opening in the die.


Find Patent Forward Citations

Quick Actions:

Miller, William. (1991). Method of configuring extrudate flowing from an extruder die assembly (U.S. Patent No. 5069853). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5069853

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…