The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 1991
Filed:
Mar. 23, 1989
Applicant:
Inventor:
Kenichi Kinoshita, Machida, JP;
Assignee:
Tel Sagami Limited, Kanagawa, JP;
Primary Examiner:
Int. Cl.
CPC ...
F27D / ;
U.S. Cl.
CPC ...
414156 ; 414180 ; 432-6 ; 432152 ; 432253 ;
Abstract
A semiconductor wafer-processing apparatus has a plurality of support members provided respectively for the processing units of a processing apparatus, and designed for supporting wafer receptacles each containing semiconductor wafers, and receptacle-inserting/extracting mechanism for inserting a wafer receptacle from the support members into the processing units, and for extracting the wafer receptacle from the processing units back to the support members. Receptacle-transporting mechanism is provided, operated independently of the receptacle inserting/extracting mechanism, for transporting the wafer receptacle between each support member and a predetermined position.