The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 1991

Filed:

Jun. 09, 1989
Applicant:
Inventors:

Yasunobu Ohshima, Tokyo, JP;

Naoki Shibanuma, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S / ; G02B / ;
U.S. Cl.
CPC ...
372 36 ; 385 34 ; 385 51 ;
Abstract

A semiconductor laser module comprises a semiconductor laser device, an optical fiber, and a lens for coupling light emitted from the semiconductor laser device to the optical fiber. There is provided a metal base having a flat portion and a pipe portion in a metal case. The semiconductor laser device is mounted on a chip carrier which is mounted on the flat portion of the metal base. The lens is fixed in the inside of the pipe portion of the metal base. The optical fiber is protected at one end by a ferrule which is fixed to the pipe portion of the metal base. A device such as a monitor photodiode and a thermistor may be mounted on the flat portion of the metal base. The flat portion of the metal base may be formed with a concave portion of an area smaller than an area of the bottom of the chip carrier. The chip carrier is soldered to the flat portion of the metal base by a low temperature solder to provide thermal connection therebetween, and by a spot welding at a point other than the soldered portion of the low temperature solder.


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