The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 1991
Filed:
Apr. 03, 1990
Applicant:
Inventors:
Hiroyuki Okumura, Hiratsuka, JP;
Masashi Kurokawa, Hatano, JP;
Akira Namikawa, Fujisawa, JP;
Hiroka Tanisake, Hiratsuka, JP;
Assignees:
Toyota Jidosha Kabushiki Kaisha, Aichi, JP;
A.G. International Chemical Company, Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L / ;
U.S. Cl.
CPC ...
524753 ; 25218228 ; 2643281 ; 2643286 ; 2643288 ; 427386 ; 528 73 ; 528 75 ;
Abstract
A process for the production of a molded article of a thermosetting resin composition by injection of a raw material component mixture containing an active hydrogen compound (A) with a polymerizable vinyl monomer (B) and a raw material component containing a polyisocyanate compound (C) into a mold charged with a fiber (D), and a material which is a mixture of the active hydrogen compound (A) with the polymerizable vinyl monomer (B) or a combination of the mixture with the polyisocyanate compound (C).