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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 5068068 B1

PDFFull Text
Date of Patent:
Nov. 26, 1991

Filed:

Nov. 22, 1989

Method and apparatus for extrusion

Applicant:
Inventors:

Toshihiro Furusawa, Chiba, JP;

Atsushi Satoh, Chiba, JP;

Takashi Nakajima, Tokyo, JP;

Noriaki Matsugishi, Tokyo, JP;

Assignees:

Idemitsu Kosan Co., Ltd., Tokyo, JP;

Seidensha Electronics Co., Ltd., Tokyo, JP;

Attorney:

Hidaka and Benman

Primary Examiner:

Leo B Tentoni

Int. Cl.
CPC ...
B06B / ; B29C / ; B29C / ;
U.S. Cl.
CPC ...
264 23 ; 264 401 ; 264 407 ; 264 70 ; 264 71 ; 264 72 ;
Abstract

An improved method for carrying out an extrusion is provided, wherein an extrusion material in a flowable state is passed through a die under a pressure to impart a desired shape thereto, and the extrusion is carried out while the die is resonated by an ultrasonic wave in such a manner that the resonance occurs at an n wavelength, wherein n is m/2 and m is a positive integer. Further, an apparatus suitable for carrying out this extrusion method is provided.

Find Patent Forward Citations

Furusawa, Toshihiro. (1991). Method and apparatus for extrusion (U.S. Patent No. 5068068). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5068068

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