The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 1991
Filed:
Jan. 25, 1991
Applicant:
Inventors:
Erik W Walles, Rensselaer, NY (US);
John H Lupinski, Scotia, NY (US);
James V Crivello, Clifton Park, NY (US);
Assignee:
General Electric Company, Schenectady, NY (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
523443 ; 357 72 ; 523466 ; 525481 ; 525482 ; 525485 ; 525506 ; 528 92 ; 528102 ;
Abstract
A heat curable composition is provided which is useful for encapsulating microelectronic devices using a heat curable epoxy composition having a diaryliodonium hexafluoroantimonate salt as a catalyst in combination with an effective amount of a free radical generating aromatic compound as a cocatalyst.
Walles, Erik. (1991). Encapsulation method, microelectronic devices made therefrom, and heat (U.S. Patent No. 5064882). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5064882
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