The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 1991
Filed:
Aug. 01, 1989
John J Dagostino, Santa Clara, CA (US);
Gregory L Lucas, Newark, CA (US);
Zycon Corporation, Santa Clara, CA (US);
Abstract
A method of conditioning separator mold plates for repeated use in high temperature sequential molding of printed circuit board laminates comprises the step of integrally applying at least one thin, continuous coat, preferably on the order of about 1 microinch, of a silane-based mold release composition prior to each sequential molding operation for facilitating repeated use of the plates in sequential molding operations the silane-based mold release composition is preferably applied in a continuous automated process including a spray gun, preferably of an air atomized type and more preferably of a high transfer efficiency type, for applying the coating followed by an infrared heating step, the separator mold plates being carried by a conveyor through a tunnel including the spray gun and infrared heater. Separator mold plates formed as a product of the process are adapted for use in large numbers of sequential molding operations with an additional coat of the silane-based mold release compound being applied prior to each operation because of the microinch thickness of each coating.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile