The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 1991

Filed:

Dec. 21, 1989
Applicant:
Inventors:

Hideo Suda, Imaichi, JP;

Norimasa Sato, Utsunomiya, JP;

Katsuhiko Takada, Anjo, JP;

Sumio Susa, Anjo, JP;

Yasushi Aiyoshizawa, Nikko, JP;

Kenichi Omata, Imaichi, JP;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
428610 ; 428674 ; 428675 ;
Abstract

A copper fin material for heat-exchanger characterized in that, on the surface of Cu or Cu alloy strip, the formation of an inner side diffused layer comprising Cu and Zn and a surface side diffused layer being provided on the surface side thereof and comprising Cu, Zn and elements with a lower diffusion coefficient into Cu than that of Zn is disclosed. A method of producing the same is characterized in that, after an alloy film comprising elements with a lower diffusion coefficient into Cu than that of Zn and Zn was formed on the surface of Cu or Cu alloy strip, a diffusion treatment is given under heat so that, on the surface of Cu or Cu alloy strip, an inner side diffused layer comprising Cu and Zn and a surface side diffused layer being provided on the surface side thereof and comprising Cu, Zn and elements with a lower diffusion coefficient into Cu than that of Zn are formed, or the diffusion treatment under heat and the rolling processing are given.


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