The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 1991
Filed:
Jan. 09, 1990
Applicant:
Inventor:
Yukun Hsia, Santa Ana, CA (US);
Assignee:
Northrop Corporation, Hawthorne, CA (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 71 ; 357 68 ; 357 80 ; 357 81 ;
Abstract
A multichip electronic package uses a silicon substrate for chip mounting and interconnects, micro-machined inverted and non-inverted truncated vias for intrinsically hermetically sealed I/O connections, and an anodically bonded silicon cover, with support posts. Stacked, colocated and inverted vias are provided for increased chip and interconnect density within an intrinsically sealed, thermally matched package.