High density connector

Abstract

An electrical connector for interconnecting a pair of circuit members (e.g., circuit module and printed circuit board) which assures highly reliable yet separable connections for these members. The connector includes an electrically insulative (e.g., plastic) frame which defines an internal opening therein. Bridging this opening are a plurality of individual, resilient contact members which are maintained in a suspended and spaced orientation within the opening by a plurality of pairs of elongated insulative members (e.g., polymer rods). Each of the contacts is thus readily removable from the conenctor's frame to thus facilitate repair and/or replacement. As described, the connector is capable of providing wiping connections, thus assuring removal of debris or other contaminants from the respective conductive pads for each circuit member. In another embodiment, the connector includes a common carrier (e.g., plastic) having therein a plurality of cylindrical shaped resilient contact members (e.g., silicone) which further include a quantity of conductive (e.g., metallic) particles therein. To assure a wiping form of engagement with the respective conductive pads, each of the terminal ends of each contact member preferably includes a plurality of dendritic, interdigitated members thereon.