The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 1991

Filed:

Aug. 20, 1990
Applicant:
Inventor:

Elio A Mariani, Hamilton Square, NJ (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
3103 / ; 310344 ; 310346 ;
Abstract

A low-cost SAW device package comprises a ceramic or glass carrier chip, a SAW device substrate mounted on the carrier chip via a conventional adhesive and a package cover mounted over the SAW device by a glass frit. The glass frit provides a tight vacuum seal for the SAW device so that outside contamination is prevented. The package cover is fabricated of a low-cost nonmetallic, non-single crystalline material (i.e. glass) having thermal characteristics similar to or the same as those of the SAW device substrate. The packaged SAW device is mounted into a circuit or subsystem using conventional bonding techniques.


Find Patent Forward Citations

Mariani, Elio. (1991). Low-cost saw packaging technique (U.S. Patent No. 5059848). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5059848

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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