The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 1991
Filed:
Oct. 04, 1989
Hiroshi Kihara, Narashino, JP;
Eiki Arai, Narashino, JP;
Shigeaki Ogata, Nagareyama, JP;
Yoshio Katagiri, Tokyo, JP;
Katsuyuki Fujita, Tokyo, JP;
Tadahiko Wachigai, Sendai, JP;
Hiroyoshi Hiratsuka, Sendai, JP;
Sumitomo Cement Co., Ltd., Tokyo, JP;
Seiko Instruments Inc., Tokyo, JP;
Seiko Electronic Components Ltd., Sendai, JP;
Abstract
Using an organic binder containing at least one water-soluble thermoplastic organic polymer and at least one water-insoluble thermoplastic organic polymer, the water-soluble thermoplastic organic polymer is extracted by debinding treatment in which a plastic molded part such as injection molded part and water are brought into contact with each other to prevent the occurrence of cracks in the molded part. Removal by extraction of the water-soluble thermoplastic polymer reduces the amount of the organic binder contained in the molded part sufficiently, thus preventing the softening and deformation of the molded part at the time of optionally heating and removing the remainder of the organic binder and/or sintering of the molded part and also preventing the occurrence of swelling and cracks by the effect of guide passage formed by the extraction of the organic polymer. Thermal debinding prior to sintering can be eliminated when polyethylene oxide is used as the water-soluble binder, which enables considerable reduction in the time required for debinding.