The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 1991
Filed:
Dec. 08, 1989
Applicant:
Inventors:
Yasutsugu Tsutsumi, Fukuoka, JP;
Sueyoshi Tanaka, Fukuoka, JP;
Tatsuro Takahashi, Fukuoka, JP;
Yutaka Morita, Fukuoka, JP;
Hideaki Seuzaki, Fukuoka, JP;
Hiromichi Yamada, Fukuoka, JP;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
26427214 ; 26427217 ;
Abstract
A method of resin sealing semiconductor devices wherein semiconductor devices, such as semiconductor chips, are placed in cavities provided in a pair of chase blocks which are clamped by a press machine through support members capable of elastic compressive deformation. Plastic is then injected into the cavities of the chase blocks to resin seal the semiconductor devices.