The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 1991

Filed:

May. 17, 1990
Applicant:
Inventors:

Ronald A Hertzer, Milford, OH (US);

Jeffrey A Chappell, Milford, OH (US);

Assignee:

Cincinnati Milacron Inc., Cincinnati, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
264 405 ; 425150 ; 425167 ; 425171 ; 425593 ; 4254516 ;
Abstract

A method and apparatus for automatically setting the die height platen on a toggle-operated injection molding machine to achieve a desired mold clamping force. A control is provided and contains information relating a desired clamp tonnage with a toggle crosshead displacement, in order to permit setting the die height platen for a particular set of molds so that the clamp, when operated, will automatically provide the desired clamping force between the mold members. The adjustment is provided by moving the die height platen in response to deviations from a predetermined set of conditions, the die height platen being moved by an hydraulic motor and chain drive to shift the die height platen along guide rods that extend between the die height platen and a stationary mold platen.


Find Patent Forward Citations

Hertzer, Ronald. (1991). Method of setting and maintaining a desired mold clamping force (U.S. Patent No. 5059365). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5059365

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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