The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 1991

Filed:

May. 30, 1989
Applicant:
Inventors:

Tetsuo Yoshizawa, Yokohama, JP;

Hiroshi Kondo, Yokohama, JP;

Takashi Sakaki, Tokyo, JP;

Masaaki Imaizumi, Tokyo, JP;

Hideyuki Nishida, Kawasaki, JP;

Yasuteru Ichida, Tokyo, JP;

Masaki Konishi, Ebina, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
2281802 ; 228110 ; 219 8511 ;
Abstract

A method of making an electric circuit device by connecting first and second electrical circuit components through an electrical connecting member. The method comprises effecting internal heating such as supersonic heating, high-frequency induction heating, high-frequency dielectric heating or microwave heating at first connecting regions between the connecting portions of the first electrical circuit component and the first ends of the electrically conductive members of the electrical connecting member. The same internal heating may also be effected at second connecting regions between the connecting portions of the second electrical circuit component and the second ends of the electrically conductive members of the electrical connecting member. In consequence, alloying takes place in first and second connecting regions so as to connect the first and second electrical circuit components through the electrical connecting member.


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