Filling and sealing apparatus for fluid containing package

Abstract

A filling and sealing apparatus has a temporary spout attaching device for temporarily attaching a spout onto a wall of a package having one end open and the other end closed, a spout fusing device for fusing the temporarily attached spout to the package, a filling device for filling the package with fluid through the open end thereof and a package sealing device for sealing the open end of the package filled with liquid. The spout fusing device includes an anvil adapted to be inserted into the package having the temporarily attached spout, a ultrasonic fusing device arranged in facing relation to the anvil and a temperature regulation device for supplying temperature regulation fluid through the anvil. The anvil may be formed with a groove in one of side surfaces thereof for receiving the temporarily mounted spout. The spout fusing device has a ultrasonic vibration horn. The ultrasonic horn has a top end portion formed with a recess for receiving a pouring portion of the spout protruding outwardly from the package and vibrating at ultrasonic frequency. An elastic member is provided in the recess of the ultrasonic vibration horn and partially in contact with an inner peripheral surface of the recess, so that the spout is pressedly held by the elastic member.