The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 1991
Filed:
Apr. 20, 1990
Natraj C Iyer, Monroeville, PA (US);
Eleanor Gettliffe, Murrysville, PA (US);
Westinghouse Electric Corp., Pittsburgh, PA (US);
Abstract
A ceramic-based coating is provided on a sealing surface of a sealing assembly component by processing and applying a powder mixture of ceramic particles and metal binder, encasing the coating of powder on the sealing surface by applying a metallic cover thereover, evacuating the atmosphere between the cover and coating, hot isostatic pressing the component and coating, cooling the component and coating, and after cooling thereof removing the cover from the coating. The powder processing includes mixing the ceramic particles and metal binder to produce a mixture, pretreating the mixture by heating it to the melting point of the metal binder which is less than the melting point of the ceramic particles to produce a mass of ceramic particles coated with molten metal binder and having a reduced gas content, cooling the mass of ceramic particles coated with molten metal binder to produce a solid mass thereof, and pulverizing the solid mass of metal binder coated-ceramic particles to granulate the powder mixture of ceramic particles to the desired size and still at least partially coated with metal binder. The resultant coating is densified substantially to its full theoretical density, metallurgically bonded to the substrate exterior surface, and has ceramic particles which are interparticle bonded together due to the processing step.