The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 1991
Filed:
Sep. 04, 1990
Yasuhiro Murasawa, Itami, JP;
Hitoshi Toda, Itami, JP;
Hiroshi Sawano, Itami, JP;
Hideya Yagoura, Itami, JP;
Abstract
A semiconductor device mounted on a substrate. Outer leads, partially resin-molded, have a greater height above the mounting surface than that of a conventional device. Specifically, each lead projecting from the molded resin has a bent portion which is convex in the direction opposite to the mounting surface, and the length of the lead beyond the bent portion is greater than the distance from the lead portion adjacent to the resin portion of the lead to the mounting surface. The long leads improve reliability during, e.g., heat cycle, tests. In another embodiment, outer leads, partially resin-molded, have reverse J-shaped bent portions, each with a distal end positioned away from the resin. When the bent portions serve as soldering portions, the soldering condition can be easily checked.