The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 1991

Filed:

Aug. 10, 1989
Applicant:
Inventors:

Robert J Blacka, Pennsauken, NJ (US);

Francis J Verderame, Berlin, NJ (US);

Assignee:

EMC Technology, Inc., Cherry Hill, NJ (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B24C / ;
U.S. Cl.
CPC ...
51413 ; 51310 ;
Abstract

A method is provided for soldering using tin-containing solder to substrate surfaces that are gold plated wherein a selected portion of the gold plated surface is treated by impacting with a high velocity stream of fine nickel containing abrasive particles to remove all the gold from the treated surface and then effecting joining to the treated surface by conventional soldering techniques.


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