The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 1991
Filed:
Oct. 24, 1989
Tom A Oudick, Eastsound, WA (US);
Gregory Shmunis, San Francisco, CA (US);
Amdahl Corporation, Sunnyvale, CA (US);
Abstract
A liquid cooled integrated circuit assembly including a plurality of integrated circuit packages for housing and electrically interconnecting integrated circuits, a printed circuit board for mounting the integrated circuit packages, and flexing tubing for supplying coolant to the integrated circuit packages. Each integrated circuit package has a first cavity housing the semiconductor die and a second cavity for receiving the liquid coolant. The integrated circuit is mounted on a portion of the package which forms a wall separating the first and second cavities. Heat is transformed from the integrated circuit to the coolant by the wall separating the cavities. Thus, a minimum number of thermal interference are involved in transferring the heat generated by the integrated circuit and the thermal resistance of the heat transferring structure is approximately one-third of the thermal resistance of conventional packages.