The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 1991
Filed:
Apr. 14, 1988
Applicant:
Inventors:
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 80 ; 357 75 ; 357 68 ; 357 71 ;
Abstract
Plural semiconductor elements are buried into an insulating substrate, and top surfaces of semiconductor elements and the substrate are in a same plane. A photosensitive dry film is covered on surfaces of the substrate and semiconductor elements. The photosensitive dry film has openings corresponding to electrodes of semiconductor elements, and conductors are filled in openings of the photosensitive dry film. The device has the multi-layer wiring construction without damaging to semiconductor elements arranged on the substrate.
Saito, Tamio. (1991). Electronic circuit device and method of manufacturing same (U.S. Patent No. 5049980). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5049980
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile