Apparatus for stripping scrap from die cut blanks

Abstract

An apparatus for stripping the scrap portion from a die cut blank includes a stripper pin carrier providing a pattern of stripper pins supported in a resilient compressible material layer in which the stripper pins are demountably embedded. The stripper pins may be inserted into the reslient layer to provide a pattern or patterns which will accommodate virtually any size, shape and location of scrap portions to be stripped from a blank. The stripper pins can be removed and reinserted in a different pattern to accommodate a different run of blanks of corrugated paperboard or the like. Programmable robotic control may be used for pin placement and removal. The stripper pin pattern, location and rotation are synchronized with operation of the upstream cutting die such that the die cut blanks move continuously under the stripper roll for automatic scrap stripping. A unique positive stripping apparatus includes a resilient soft-covered roll beneath the blank at the point of stripping and into which the leading edge of the scrap portion is pressed by the stripper pins on the upper rotary pin-carrying roll. Supplemental indexing of the stripper pin carrier is utilized to assure fresh pin placement areas in the resilient material layer to eliminate inaccuracies in pin placement or poor pin retention because of material wear through repeated use.