The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 1991

Filed:

Sep. 15, 1988
Applicant:
Inventors:

Josef T Franek, Chorleywood, GB;

Paul Porucznik, Kennington, GB;

Peter H Serby, Newbury, GB;

Christopher J Tod, Steyning, GB;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B21D / ; B21D / ;
U.S. Cl.
CPC ...
413 19 ; 413-6 ; 413 31 ;
Abstract

A method of making a container by laminating a metal substrate layer and a polymeric material layer together by bonding over the whole of at least one side of the metal substrate layer thereby forming a laminate container component, providing another container component, forming one of the container components into a tubular container body component having an opening set off by a peripheral edge portion, forming the other of the container components into a container closure component having a peripheral edge portion, assembling the container body component and the container closure component with the polymeric material layer in sandwiched relationship between the peripheral edge portions and in the complete absence of adding any additional sealing material between the peripheral edge portions other than the polymeric material layer of the first step and mechanically deforming the peripheral edge portions into a mechanical joint with sufficient force to compress the polymeric material layer and form an an air/gas-tight seal between the peripheral edge portions of the mechanical joint in the absence of any bonding of the polymeric material layer with the mechanically deformed mechanical joint.


Find Patent Forward Citations

Loading…