The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 1991

Filed:

Feb. 15, 1989
Applicant:
Inventors:

Toichi Sakata, Katsuta, JP;

Kenji Hattori, Hitachi, JP;

Yoshiyuki Mukoyama, Hitachi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08G / ; C08G / ; C08G / ;
U.S. Cl.
CPC ...
528313 ; 528337 ; 528350 ;
Abstract

High molecular weight polyamide-imides having a reduced viscosity of 0.3 dl/g or above and exhibiting excellent heat resistance and melt flowability are produced with good economic efficiency by a process, which process comprises the two reaction stages:


Find Patent Forward Citations

Sakata, Toichi. (1991). Process for the production of high molecular weight polyamide-imide resin (U.S. Patent No. 5047499). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5047499

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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