The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 1991

Filed:

Sep. 02, 1988
Applicant:
Inventor:

Satyam C Cherukuri, Northford, CT (US);

Assignee:

Olin Corporation, New Haven, CT (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C03C / ; C03C / ; C03C / ; C03C / ;
U.S. Cl.
CPC ...
501 21 ; 501-5 ; 501 22 ; 501 26 ; 501 60 ; 501 61 ; 501 62 ; 501 63 ; 501 65 ; 501 66 ; 501 67 ; 501 68 ; 501 69 ; 501 72 ;
Abstract

The present invention relates to a glass/ceramic sealing system. A sealing glass having a coefficient of thermal expansion in excess of 160.times.10.sup.-7 in/in/.degree. C. is provided. The glass is useful for matched sealing of copper and copper based alloys. The glass is capable of ceramization, greatly increasing the resistance of the glass to moisture penetration and fracture due to mechanical damage. The temperature of ceramization has been designed so that a solutionized copper alloy leadframe is age hardened during ceramization. The glass has particular utility in the manufacture of electronic packages and multi-layer circuitry.


Find Patent Forward Citations

Cherukuri, Satyam. (1991). Glass/ceramic sealing system (U.S. Patent No. 5047371). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5047371

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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