The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 1991

Filed:

May. 25, 1990
Applicant:
Inventors:

Robert W Shreeve, Corvallis, OR (US);

Michael D Dobbs, Vancouver, WA (US);

Lucy E Burris, Vancouver, WA (US);

Robert B Freund, Owego, NY (US);

Ronald W Keil, Corvallis, OR (US);

Assignee:

Hewlett-Packard Company, Palo Alto, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R / ; H05K / ;
U.S. Cl.
CPC ...
439 66 ; 29840 ; 174260 ; 2281802 ; 439 68 ; 439331 ;
Abstract

Method and apparatus for creating an electrical connection between a tape-assisted bonding (TAB) segment having a plurality of conductive leads formed thereon and a printed circuit board also having a plurality of conductive leads formed thereon. A sheet of polymeric material having conductive elements mounted thereon so that each element protrudes from both sides of the sheet is disposed between a plurality of TAB segment leads and a corresponding plurality of generally opposing printed circuit board leads. A clamp secures the TAB segment to the printed circuit board thereby sandwiching the conductive elements between the TAB segment leads and the printed circuit board leads thus creating electrical connections between the opposing leads.


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