The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 1991
Filed:
Aug. 15, 1989
Keisuke Oguro, Osaka, JP;
Hiroshi Ishikawa, Osaka, JP;
Hiroshi Suzuki, Osaka, JP;
Akihiko Kato, Osaka, JP;
Teruya Okada, Osaka, JP;
Shizuo Sakamoto, Osaka, JP;
Agency of Industrial Science & Technology, Tokyo, JP;
Kurimoto Ltd., Osaka, JP;
Abstract
This invention relates to a method for manufacturing a heat transfer module to improve the thermal efficiency of a hydrogen adsorption alloy. The hydrogen absorption alloy particles are coated with a metal which is different from that of the alloy, followed by the formation of a compact with the coated particles. The compact so formed has a substantially uniform specific gravity. The compact is then inserted in a pipe mode of a metal which is different from that of the alloy. The pipe has an internal diameter which is a function of the diameter of the compact and the free expansion coefficient of the compact. The method will improve the usefulness of hydrogen adsorption alloy in practical use.