The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 1991

Filed:

Sep. 27, 1989
Applicant:
Inventors:

Yuuzi Takada, Hadano, JP;

Ritsuji Toba, Hadano, JP;

Satoshi Yoshitomi, Hadano, JP;

Nobuaki Ooki, Hadano, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D / ;
U.S. Cl.
CPC ...
427243 ; 118423 ; 118424 ; 118425 ; 118428 ; 118500 ; 427 97 ; 427 98 ; 4274431 ; 4274432 ;
Abstract

A method for treating the interior surfaces of holes as well as the surfaces of a perforated workpiece by dipping it into treating liquid includes a step of causing treating liquid to flow at both ends of the holes in a direction perpendicular to these holes at different velocities. In order to create these liquid flows at different velocities, the workpiece is dipped in the liquid so that the holes extend substantially horizontally, and air bubble jets are alternately delivered along both ends of the holes, or fins are provided at locations adjacent both ends of the holes so as to extend outwardly upwardly at one side of the hole ends and extend outwardly downwardly at the other side of the hole ends, and these fins are moved upwardly and downwardly.


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