The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 1991
Filed:
Nov. 14, 1989
Masayuki Tsunaga, Ina, JP;
Kazuaki Yuba, Ageo, JP;
Yoshiaki Kurimoto, Takasaki, JP;
Maraki Hirosawa, Takasaki, JP;
Mitsui Mining & Smelting Co., Tokyo, JP;
Gunei Chemical Industry Co., Ltd., Takasaki, JP;
Abstract
A copper conductive composition comprising 100 parts by weight of spherical copper powder coated with silver as metal powder, 6 to 18 parts by weight of resol type phenolic resin containing a dimethylene ether bond in bonded formaldehyde by 5% or more, the molar ratio between the formaldehyde thereof and phenol thereof (formaldehyde/phenol) being 1.0 to 3.0, 0.05 to 1 parts by weight of dispersant, and 2 to 15 parts by weight of solvent. Therefore, an excellent conductivity and solderability of the cured film can be obtained.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile