The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 1991
Filed:
Dec. 05, 1989
Nozomu Hama, Sayama, JP;
Takaaki Sato, Sayama, JP;
Akihiko Koshiro, Sayama, JP;
Masao Tegawa, Sayama, JP;
Tomio Iino, Sayama, JP;
Seiji Yanagisawa, Sayama, JP;
Nobuo Kikuchi, Sayama, JP;
Kazuo Migishima, Sayama, JP;
Kazumi Ishida, Sayama, JP;
Honda Giken Kogyo Kabushiki Kaisha, Tokyo, JP;
Abstract
An apparatus for molding a product such as an automotive instrument panel of synthetic resin has a first station including a mechanism for opening and closing a mold assembly, a second station including a mechanism for pouring a resin solution into the mold assembly which is closed, and a third station for hardening the poured resin solution in the mold assembly. A feed mechanism interconnects the first, second, and third stations in a looped configuration for circulating at least three mold assemblies through the first, second, and third stations. The mold assembly includes a first mold die for placing therein a covering sheet of a predetermined shape, a second mold die combinable with the first mold die to define a mold cavity therebetween, and a mechanism for pouring a resin foam solution into the mold cavity to form a molding integral with the covering sheet.