The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 1991
Filed:
Dec. 11, 1989
David Billings, Mesa, AZ (US);
Soon C Hong, Seoul, KR;
Motorola, Inc., Schaumburg, IL (US);
Abstract
A mold assembly having a first mold half and a second mold half forms a cavity when the first and second mold halves are mated together. Pins or projections, which extend into the cavity, are provided by the mold halves. A semiconductor leadframe rests on the pins provided by the lower mold half and are spaced a short distance from the pins provided by the upper mold half. The pins from the lower mold half support the leadframe whereas the upper mold half pins restrict the movement of the leadframe during an encapsulating procedure. By shortening the pins from the upper mold half the entire upper surface of the leadframe is encapsulated. This eliminates the necessity of having to backfill the holes left in the encapsulating material after the encapsulating procedure.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile