The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 1991

Filed:

Oct. 16, 1989
Applicant:
Inventors:

Bruce C McDermott, Penfield, NY (US);

Leslie G Moore, Jr, Webster, NY (US);

John D Meierdiercks, Rochester, NY (US);

James R Milch, Pittsford, NY (US);

Assignee:

Eastman Kodak Company, Rochester, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361387 ; 174 163 ; 357 30 ; 357 81 ; 361384 ;
Abstract

The present image sensor mounting system is particularly adapted to the mounting of a linear sensor array, of the type having a transparent window on a front surface and a thermal and electrically conductive back surface. The system provides superior electrical and thermal transfer characteristics. A heat sink having at least one flat surface is positioned to make thermal contact with the back surface of the image sensor. A multilayer circuit board having layers of conductive material separated by layers of insulating material and having an opening therethrough sufficient in size to accept the heat sink provides the system support. A metal plating extends from one surface of the board through the opening in the board to the opposite surface of the board with selected ones of the layers of conductive material making electrical contact with the metal plating. The heat sink is mounted in the multilayer circuit board opening in thermal and electrical contact with the metal plating. A layer of thermal and electrically conductive grease is layered between the at least one surface of the heat sink and the conductive back surface of the linear sensor array.


Find Patent Forward Citations

Loading…