The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 1991
Filed:
Feb. 06, 1990
Applicant:
Inventor:
Theodore V Lester, Schiller Park, IL (US);
Assignee:
Motorola, Inc., Schaumburg, IL (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 81 ; 357 71 ; 357 75 ; 357 58 ;
Abstract
A substrate of copper clad alumina lamina bearing a number of semiconductor dies is adapted to be soldered to a heatsink to provide electrically isolated thermal relief for the dies. Channels of reduced lamina depth are provided between the dies in regions of no cladding to provide a stress relief fracture path. Stresses caused by the mismatch between the thermal coefficient of expansion of the lamina and is heatsink as the substrate is temperature cycled are fracture relieved without risk of die damage or die or substrate detachment.