The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 1991
Filed:
May. 18, 1990
Rembert R Stokes, Inverness, IL (US);
Fred E Ostrem, Long Grove, IL (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
An electrical component/housing has a main body with a geometric central point and a lead frame having a plurality of leads formed of flat sheet stock. An intermediate flexible planar portion of each lead extends between emerging and end portions of each lead. The intermediate portion is orientated toward the central point so as to maximize absorption of thermal expansion stresses which are radially directed between the central point and the end lead portion which will be bonded to another structure. Also, a thermally stable connection arrangement comprising: a substrate having an electrical conductor thereon to which a component lead is connected at a third position, the substrate having a first coefficient of thermal expansion (a.sub.1); a heat sink base upon which the substrate is located at a first position, the base having a second predetermined coefficient of thermal expansion (a.sub.2); and a housing fixed to the base at a second position and having the lead extending therefrom to the electrical conductor to which it is soldered, the lead having a third predetermined coefficient of thermal expansion (a.sub.3). A first distance (l.sub.1) between the first position and the third position and a second distance (l.sub.2) between the first position and the second position being in the ratio (a.sub.2 -a.sub.3)/(a.sub.1 -a.sub.3) so that there is substantially no differential movement due to thermal expansion between the substrate and the component lead at the third position.