The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 1991
Filed:
Mar. 30, 1988
Applicant:
Inventors:
Akira Yoshizumi, Yokohama, JP;
Kazutaka Matsumoto, Yokohama, JP;
Shinetsu Fujieda, Kawasaki, JP;
Ken Uchida, Tokyo, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Primary Examiner:
Int. Cl.
CPC ...
B32B / ; B32B / ; C08K / ; C08K / ;
U.S. Cl.
CPC ...
428331 ; 174 522 ; 428413 ; 523209 ; 523466 ; 523438 ;
Abstract
An epoxy resin composition useful for sealing a semiconductor device includes 100 parts by weight of epoxy resin, 30-75 parts by weight of phenolic resin, 320-570 parts by weight of silica powder, and 2-30 parts by weight of styrene-butadiene-methyl methacrylate copolymer. The surface of the silica powder is treated, at room temperature, by 0.05-1.00% by weight of silane coupling agent, 0.05-1.00% by weight of a silicone base surface active agent, and 0.15-3.00% by weight of thermosetting silicone rubber.