The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 1991

Filed:

Dec. 08, 1988
Applicant:
Inventors:

Jing-Pin Pan, Hsin Chu Hsien, TW;

Ker-Ming Chen, Hsin Chu Hsien, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08G / ; C08L / ;
U.S. Cl.
CPC ...
528114 ; 528170 ; 528322 ; 528102 ;
Abstract

This invention relates to a resin composition which is used for the production of printed circuit boards. The feature of said resin composition is to add barbituric acid or its derivatives to a bismaleimide resin, and mixed in a solvent or solvent system. The mixture is then added with epoxy resin and suitable amount of curing agent to form the required resin composition. The resin composition has high glass transition temperature and good toughness and other physical and electrical properties. Meanwhile, it would not cause phase separation, so is a high-performance material for the production of printed circuit boards.


Find Patent Forward Citations

Pan, Jing-Pin. (1991). Composition comprising epoxy resin, bismaleimide and barbituric acid (U.S. Patent No. 5041519). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5041519

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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