The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 1991
Filed:
Oct. 05, 1989
Anthony A Gallo, Olean, NY (US);
Dexter Corporation, Windsor, CT (US);
Abstract
An improved flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a higher percent of halogen (which can be part of the resin or the hardener), preferably the polyglycidyl ether of the bromophenol-formaldehyde novolac type, preferably containing at least about 1.0% of bromine by weight of the molding compound, a lower percent of sodium, preferably in the range of 0.01-0.06% by weight of the antimony pentoxide, a lower percent of antimony pentoxide, preferably in the range of from about 0.4 to about 0.8% by weight of the molding compound, and an amount of bismuth trioxide from about 1.6 to about 4.0% by weight of the molding compound. The improved flame retardant epoxy compounds when used to encapsulated semiconductor devices have improved high temperature stability and compatability, ball-lift performance, live-device performance, cost and lower toxicity compared to similar prior art molding compounds.