The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 1991
Filed:
Nov. 28, 1989
Perry Pelley, Austin, TX (US);
Tim P Egging, Colorado Springs, CO (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
An integrated circuit with reduced size through improved power supply distribution. A bonding pad supplies V.sub.SS to an integrated circuit memory, which is distributed through a plurality of power supply lines in a first metal layer and a plurality of grid lines in a second metal layer intersecting at right angles. The plurality of grid lines are placed in unused spaced in the second metal layer and are coupled to the power supply lines in the first metal layer. Together the grid lines and the power supply lines provide an improved power supply by lowering the impedance from a point on the integrated circuit to V.sub.SS supplied on the bonding pad. While this technique is ideally suited to memory devices because of the repetitive nature of blocks of memory cells, other types of integrated circuits can also utilize such a power supply distribution technique.