The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 1991
Filed:
Sep. 20, 1990
Applicant:
Inventor:
Dietrich E Riemer, Auburn, WA (US);
Assignee:
The Boeing Company, Seattle, WA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C / ;
U.S. Cl.
CPC ...
427 96 ; 4271263 ; 4271265 ; 427117 ;
Abstract
An improved method for producing a gold conductor on a substrate in the manufacture of a thick film hybrid circuit, such that the gold conductor is suitable for wire bonding. The method comprises screen printing a fluxless gold paste on the substrate, and then firing the substrate and paste. The paste includes the resinate of a metal that can form an alloy with gold and that can also form an oxide at the firing temperature. Suitable gold pastes include bismuth and cadmium resinates in a total amount by weight of less than 1%.