logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 5035744 B1

PDFFull Text
Date of Patent:
Jul. 30, 1991

Filed:

Jul. 09, 1990

Electroless gold plating solution

Applicant:
Inventors:

Koji Nishiyama, Saitama, JP;

Masayuki Yamazaki, Saitama, JP;

Takeshi Tsukuda, Saitama, JP;

Youtaro Arai, Saitama, JP;

Assignee:

Kojima Chemicals Co., Ltd., Tokyo, JP;

Attorney:

Wegner, Cantor, Mueller & Player

Primary Examiner:

Mark L Bell

Assistant Examiner:

Anthony J Green

Int. Cl.
CPC ...
C23C / ;
U.S. Cl.
CPC ...
106-123 ; 106-113 ; 252514 ; 427304 ;
Abstract

An electroless gold plating solution containing 0.1 to 10 ml/l of ethyleneamines and 0.1 to 10 g/l of hexamethylenetetramine as complexing agents in addition to the solution comprising water-soluble gold salts, pH controlling agents, catalysts, alkylamine boranes, alkali cyanides and ethylendiamine tetraacetic acid. According to the present invention, thick coating of a gold plating film having high quality and gloss is possible and the plating time becomes very short.

Find Patent Forward Citations

Quick Actions:

Nishiyama, Koji. (1991). Electroless gold plating solution (U.S. Patent No. 5035744). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5035744

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…