The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 1991
Filed:
Nov. 07, 1989
Shigeru Fujita, Shizuoka, JP;
Hideo Saito, Shizuoka, JP;
Katsuyuki Yamamoto, Shizuoka, JP;
Satoshi Endo, Shizuoka, JP;
Fumio Kamahora, Shizuoka, JP;
Toshiba Machine Co., Ltd., Tokyo, JP;
Abstract
An optimum molding condition setting system for an injection molding machine comprises a molten material flow analysis component for analyzing resin flow, resin cooling and the structure/stength of molded products by using a designed mold model and also comprises an analysis result evaluation component for determining an initial molding condition and its permissible range in accordance with the analysis results. The initial molding condition is set into the injection molding machine and a test shot is carried out in order to check for a deficiency of a molded product. If a deficiency of the molded product is detected, a data of the deficiency is entered into a molding defect elimination component. After performing a convenient data processing based on the entered data, a cause of the molding defect can be inferred and a measure for the cause can be obtained with high efficiency and accuracy. Consequently, the molding condition can properly and immediately be corrected in accordance with data obtained by the molten material flow analysis component.